Machine for bending conductors of a semiconductor chip device

Metal deforming – By relatively movable offset tool-faces – Multi-point tool-couple

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29741, 228 51, 228 6A, 228 151, B21D 501

Patent

active

044111495

ABSTRACT:
The invention relates to an automatic machine for bending the extending conductors of an integrated circuit chip to form contacts for mounting the chip to a substrate. This machine comprises a bending base (20), movable bending pieces (18, 19) situated opposite the bases, a ribbon insulating support (2) for the chip (1), and a platform (27) to displace the support of the chip so as to being the chip onto the base, or to remove it therefrom. This machine is characterized in that the bending base (20) includes a housing (21) having the form of the chip for receiving the chip and having a plane rim (23) adapted to surround the body of the chip. The first movable piece (18) is located in the second movable piece and has a flat rim (24) opposite the flat rim (23) of the base. The extending conductors are wedged during the bending operation between these two rims (23, 24) and the bending is carried out by the second movable piece (19) which moves rectilinearly in a vertical direction.

REFERENCES:
patent: 3724068 (1973-04-01), Galli
patent: 3887783 (1975-06-01), Comette
patent: 3949925 (1976-04-01), Keizer
patent: 4010885 (1977-03-01), Keizer
patent: 4099660 (1978-07-01), Schultz
patent: 4109096 (1978-08-01), Dehaine
patent: 4166562 (1979-09-01), Keizer
patent: 4236301 (1980-12-01), Hug
IBM Technical Disclosure Bulletin, vol. 19, No. 11, 4-1977, New York (U.S.) . Perls "Air Track", pp. 4184-4185.

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