Machine and method for applying pressure sensitive sample...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S362000, C156S364000, C156S391000, C156S580000, C156S537000

Reexamination Certificate

active

07832440

ABSTRACT:
A machine for applying pressure sensitive sample chips to a card includes a linear conveyor for receiving and transporting cards, and at least one sample application station disposed along the conveyor. The sample application station includes a feed roller overlying and spaced from the conveyor for holding a spool containing at least one row of individual pressure sensitive sample chips on a substrate. A plate has an edge immediately overlying and spaced from the conveyor to permit passage of cards beneath the edge. A drive roller is spaced from the feed roller and from the plate for drawing the substrate from the spool on the feed roller over the plate edge to separate the sample chips from the substrate and apply the chips to the cards. A resilient roller preferably is disposed adjacent to the plate edge for pressing the sample chips removed from the substrate onto the cards transported on the conveyor.

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patent: 1386888 (1975-03-01), None

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