Luminescent diode chip that is flip-chip mounted on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated

Reexamination Certificate

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Details

C257S099000, C257S778000, C257S779000, C257S788000, C257S790000, C438S026000, C438S108000, C438S124000, C438S126000, C438S127000, C438S612000

Reexamination Certificate

active

06927425

ABSTRACT:
A luminescent diode chip for flip-chip mounting on a carrier, having a conductive substrate (12), a semiconductor body (14) that contains a photon-emitting active zone and that is joined by an underside to the substrate (12), and a contact (18), disposed on a top side of the semiconductor body (14), for making an electrically conductive connection with the carrier (30) upon the flip-chip mounting of the chip, whereby either the carrier is solder covered or a layer of solder is applied to the contact. An insulating means (40, 42, 44, 46, 48) is provided on the chip, for electrically insulating free faces of the semiconductor body (14) and free surfaces of the substrate (12) from the solder.

REFERENCES:
patent: 5345092 (1994-09-01), Kurihara
patent: 5579573 (1996-12-01), Baker et al.
patent: 6268230 (2001-07-01), Kuniyasu
patent: 6740906 (2004-05-01), Slater et al.
patent: 689 15 873 (1994-06-01), None
patent: 0 351 092 (1994-06-01), None
patent: 61222136 (1986-10-01), None
patent: 08172238 (1996-07-01), None
patent: 11068153 (1999-03-01), None
patent: 11251360 (1999-09-01), None
Wlodzimierz Nakwasi, “Thermal Properties of the Burrus-Type Light-Emitting Diode: Part I-The Model”, IEEE Transactions on Electron Devices, vol. Ed. 33 No. 7, Jul. 1986, pp. 889-907.
Shuji Nakamura, et al., “The Blue Laser Diode GaN Based Light Emitters and Laser” published by Springer Verlag, Berlin and Heidelberg, 1997, pp. 7-12.

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