LSI package with interface module and interface module

Details LSI package with interface module and interface module LSI package with interface module and interface module

2008-08-07

2010-02-23

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S772000, C361S774000

Reexamination Certificate

active

07667982

ABSTRACT:
An LSI package includes an interface module having first and second surfaces and including a wiring board having a first through hole, a driver selectively provided on the second surface, a transmission line connected to the driver, and a first terminal formed on the second surface and connected to the driver, an interposer having a third surface facing the second surface and a fourth surface, and including a signal processor and a second terminal provided on the third surface, a third terminal provided on the fourth surface and a second through hole, the third surface facing the second surface except a region where the driver portion is provided. The interposer is arranged so that the first through hole matches with the second through hole, and a movable guide pin is inserted into the first and second through holes to position the interface module and the interposer.

REFERENCES:
patent: 5953214 (1999-09-01), Dranchak et al.
patent: 6699046 (2004-03-01), Ho et al.
patent: 6906407 (2005-06-01), Byers et al.
patent: 6937824 (2005-08-01), Watanabe
patent: 7394665 (2008-07-01), Hamasaki et al.
patent: 2006/0038287 (2006-02-01), Hamasaki et al.
patent: 2004-253456 (2004-09-01), None
Hiroshi Hamasaki, et al., “Novel Optoelectronic LSI Packaging Suitable for Standard FR-4 Printed Wiring Board with Bandwidth Capability of Over 1Tbps”, 2006 Electronic Components and Technology Conference, 2006, pp. 298-302.
Hiroshi Hamasaki, et al., “An Ultra High Performance 1 Tbps bandwidth Optoelectronic LSI Package using Post-reflow optical-interface Stacking Technique”, 2007 Proceedings, IMAPS 4thInternational Symposium on Microelectronics, Nov. 2007, 8 Pages.

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