LSI package provided with interface module, and transmission...

Details LSI package provided with interface module, and transmission... LSI package provided with interface module, and transmission...

2005-03-17

2008-08-12

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S723000

Reexamination Certificate

active

07411282

ABSTRACT:
An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.

REFERENCES:
patent: 6906407 (2005-06-01), Byers et al.
patent: 2005/0230795 (2005-10-01), Furuyama et al.
patent: 7-22594 (1995-04-01), None
patent: 2000-183370 (2000-06-01), None
patent: 2001-91174 (2001-04-01), None
patent: 2001-313438 (2001-11-01), None
patent: 2001-318283 (2001-11-01), None
patent: 2004-87790 (2004-03-01), None
U.S. Appl. No. 11/204,168, filed Aug. 16, 2005, Furuyama et al.
U.S. Appl. No. 11/203,959, filed Aug. 16, 2006, Hamasaki et al.
U.S. Appl. No. 11/233,175, filed Sep. 23, 2005, Furuyama et al.
U.S. Appl. No. 11/442,276, filed May 30, 2006, Hamasaki et al.
U.S. Appl. No. 11/472,367, filed Jun. 22, 2006, Hamasaki et al.
U.S. Appl. No. 11/496,446, filed Aug. 1, 2006, Furuyama et al.
U.S. Appl. No. 11/531,922, filed Sep. 14, 2006, Hamasaki et al.

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