LSI package provided with interface module and method of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S706000, C361S767000, C361S764000, C361S784000

Reexamination Certificate

active

07394665

ABSTRACT:
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals of the circuit module, second electric terminals for electrically connecting the circuit module to the mounting board, internal wirings electrically connected to the first signal terminals, and first coupling parts electrically connected to the internal wirings. An interface module is provided with a signal transmission line for transmitting the signals and second coupling parts electrically connected to the transmission line. The second coupling part is electrically and mechanically connected to the first coupling parts, respectively.

REFERENCES:
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 6906407 (2005-06-01), Byers et al.
patent: 6954084 (2005-10-01), Islam
patent: 2004/0218372 (2004-11-01), Hamasaki et al.
patent: 2-24810 (1990-02-01), None
patent: 4-158565 (1992-06-01), None
patent: 6-214140 (1994-08-01), None
patent: 8-97352 (1996-04-01), None
patent: 8-250657 (1996-09-01), None
patent: 9-236730 (1997-09-01), None
patent: 10-214981 (1998-08-01), None
patent: 2000-82826 (2000-03-01), None
patent: 2000-82828 (2000-03-01), None
patent: 2000-183370 (2000-06-01), None
patent: 2002-94247 (2002-03-01), None
patent: 2002-232054 (2002-08-01), None
patent: 2002-232058 (2002-08-01), None
patent: 0158783 (1998-08-01), None
patent: 2002-0021366 (2002-03-01), None
Definitions of LSI found on the Internet through Google (one sheet).
U.S. Appl. No. 10/778,030, filed Feb. 17, 2004, Hamasaki et al.
U.S. Appl. No. 11/015,013, filed Dec. 20, 2004, Furuyama et al.
U.S. Appl. No. 11/081,617, filed Mar. 17, 2005, Furuyama et al.
U.S. Appl. No. 11/204,168, filed Aug. 16, 2005, Furuyama et al.
U.S. Appl. No. 11/203,959, filed Aug. 16, 2005, Hamasaki et al.
U.S. Appl. No. 11/233,175, filed Sep. 23, 2005, Furuyama et al.
Jerome Eichenberger, et al., “Multi-Channel Optical Interconnection Modules up to 2.5Gb/s/ch”, Proc. 51st2001 Electronic Components and Technology Conference, 2001, pp. 880-885.
Takashi Yoshikawa, et al., “Optical-interconnection as an IP macro of a CMOS Library”, Proc. Hot Interconnects 9, Symposium on High Performance Interconnects, 2001, pp. 31-35.
M. Okabe, et al., Proc. The 16thJIEP Annual Meeting, 2002, vol. 20B, No. 10, pp. 283-284.
U.S. Appl. No. 11/496,446, filed Aug. 1, 2006, Furuyama et al.

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