LSI package having a multilayer ceramic substrate

Details LSI package having a multilayer ceramic substrate LSI package having a multilayer ceramic substrate

1984-07-12

1990-01-16

Sikes, William L.

357 70, 357 71, 357 74, 357 40, 357 45, H01L 3902, H01L 2702

Patent

active

048947083

ABSTRACT:
A large scale integrated package comprises a substrate having a power supply layer and a signal wiring layer. A plurality of pads for connecting IC terminals are formed on the top surface of the substrate. Additionally, a plurality of spare pads are also provided on the top surface of the substrate. The lower surface of the substrate has a plurality of input/output terminals which can be inserted into connectors. Additionally, the lower surface of the substrate has a plurality of spare terminals. Each of the pads and spare pads are electrically connected through the substrate to a corresponding terminal and spare terminal. A broken connection between a first pad and a first input/output terminal can be repaired by connecting the first pad to a spare pad and the first input/output terminal to the spare input/output terminal corresponding to the spare pad.

REFERENCES:
patent: 4221047 (1980-09-01), Narken et al.
patent: 4407007 (1983-09-01), Desai et al.
Clark et al., "IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density", IEEE Transaction on Components, Hybrids, and Manufacturing Technology, vol. CHMT-3, No. 1, Mar. 1980, pp. 89-93.

Affiliated with

Also associated with

Rating

LSI package having a multilayer ceramic substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LSI package having a multilayer ceramic substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LSI package having a multilayer ceramic substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1338413