LSI chip and method of producing same

Details LSI chip and method of producing same LSI chip and method of producing same

1991-03-18

1992-06-02

Wityshyn, Michael G.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29840, 29879, 156 733, 156261, 156295, 1565802, 228 11, 228110, 437 9, 437183, B29C 6508

Patent

active

051183706

ABSTRACT:
An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.

REFERENCES:
patent: 3330026 (1967-07-01), Best et al.
patent: 3357090 (1967-12-01), Tiffany
patent: 3531852 (1970-10-01), Slemmons et al.
patent: 3670394 (1972-06-01), Daniels et al.
patent: 3709775 (1973-01-01), James
patent: 3713944 (1973-01-01), Dennis et al.
patent: 3733685 (1973-05-01), Kauppila
patent: 3923584 (1975-12-01), Hojo etal.
patent: 3926357 (1975-12-01), Matrisian
patent: 4463059 (1984-07-01), Bhattacharya et al.
patent: 4618516 (1986-10-01), Sager
patent: 4680617 (1987-07-01), Ross
patent: 4693770 (1987-09-01), Hatada
patent: 4744850 (1988-05-01), Imano et al.
patent: 4749120 (1988-06-01), Hatada

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