Lower temperature glass and hermetic seal means and method

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...

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Details

65 591, 174 5061, 501 26, 501 67, 501 79, 501153, C03C 702, C03C 308

Patent

active

043496350

ABSTRACT:
An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:

REFERENCES:
patent: 3669715 (1972-06-01), Meyer
patent: 3706582 (1972-12-01), Meyer
patent: 4128697 (1978-12-01), Simpson
patent: 4152282 (1979-05-01), Baudry et al.

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