Lower temperature glass and hermetic seal means and method

Glass manufacturing – Processes – Fusion bonding of glass to a formed part

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65 43, 65 593, 65 594, 65 596, 174 5061, 501 26, 501 15, 501 67, 501 79, C03C 2900, C03C 702

Patent

active

044179138

ABSTRACT:
An improved lead-free glass or glass plus alumina ceramic sealing material composition for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:

REFERENCES:
patent: 3669715 (1972-06-01), Meyer
patent: 3706582 (1972-12-01), Meyer
patent: 4128697 (1978-12-01), Simpson
patent: 4152282 (1979-12-01), Baudry et al.
patent: 4163656 (1979-08-01), Monneraye et al.
patent: 4349692 (1982-09-01), Davis et al.
patent: 4362796 (1982-12-01), Bowsky et al.

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