Lower heat insulating cylinder for manufacturing...

Details Lower heat insulating cylinder for manufacturing... Lower heat insulating cylinder for manufacturing...

2007-02-20

2008-08-12

Sikder, Selina (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

Design Patent

active

D0574792

CLAIM:
The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

REFERENCES:
patent: 5534074 (1996-07-01), Koons
patent: D404375 (1999-01-01), Shimazu
patent: D405428 (1999-02-01), Ishii
patent: 6033215 (2000-03-01), Ohsawa
patent: 6171400 (2001-01-01), Wingo
patent: 2002/0092815 (2002-07-01), Kim et al.
patent: 2004/0069732 (2004-04-01), Huang et al.
patent: 2005/0145584 (2005-07-01), Buckley et al.
Copending U.S. Appl. No. 29/272,821, filed Feb. 20, 2007, “Upper Heat Insulating Cylinder for Manufacturing Semiconductor Wafers”.

Affiliated with

Also associated with

Rating

Lower heat insulating cylinder for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lower heat insulating cylinder for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lower heat insulating cylinder for manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4000751