Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Patent
1994-03-30
1995-07-11
Klemanski, Helene
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
106 22H, C09D 1102
Patent
active
054317240
ABSTRACT:
Wet cockle is minimized in aqueous-based, thermal ink-jet inks by adding to the ink at least one water-soluble substance, such as a solvent or salt, having a molecular weight of less than 200 grams/mole in an amount sufficient to reduce the mole fraction of water to a maximum value of about 0.5. Addition of the substance reduces wet paper cockle to a value that is less than the distance between the thermal ink-jet pen and the paper, thereby preventing a crash condition between the paper and the pen.
REFERENCES:
patent: 3776742 (1973-12-01), Sanders
patent: 4655834 (1985-08-01), Haruta et al.
patent: 4756757 (1986-12-01), Haruta et al.
patent: 5059246 (1990-10-01), Yamamoto
patent: 5207824 (1993-05-01), Moffatt et al.
Adamic Raymond J.
Radke Garold E.
Hewlett-Packard Corporation
Klemanski Helene
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