Low volatile organic content hybrid silica binder

Details Low volatile organic content hybrid silica binder Low volatile organic content hybrid silica binder

1991-10-29

1993-02-16

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Molds and mold coating compositions

10628716, 10628735, 106403, 2523156, B28B 734

Patent

active

051867435

ABSTRACT:
A low volatile organic content hybrid silica binder, with a total silica content of about 29% to about 42% by weight, suitable for use in the manufacture of zinc-rich primer coating compositions is disclosed. The binder comprises a predominant amount of a silica component derived from the hydrolysis of an organic silicate and a lesser amount of a silica component derived from a sillica sol. The solvent component comprises no more than about 75% by weight of an organic solvent having a volatility equal to or greater than the volatility of a C.sub.1 to C.sub.3 alkyl monohydric alcohol and about 25% by weight or more of a solvent having a lesser volatility than the volatility of a C.sub.1 to C.sub.3 alkyl monohydric alcohol, with the condition that no more than about 90% by weight of such lesser volatile solvent is a butanol.

REFERENCES:
patent: 2842445 (1958-07-01), Emblem et al.
patent: 3412063 (1968-11-01), Jarboe et al.
patent: 3576652 (1971-04-01), Teicher et al.
patent: 3615730 (1971-10-01), Law et al.
patent: 3682668 (1972-08-01), Fujita et al.
patent: 3961968 (1976-06-01), Wales
patent: 4378996 (1983-04-01), Yarwood
patent: 4602667 (1986-07-01), Moore et al.

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