Low voiding no flow fluxing underfill for electronic devices

Details Low voiding no flow fluxing underfill for electronic devices Low voiding no flow fluxing underfill for electronic devices

2007-07-24

2007-07-24

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C523S201000, C523S205000, C523S466000, C523S467000, C525S065000, C525S114000, C525S487000

Reexamination Certificate

active

10911908

ABSTRACT:
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

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