Low viscosity, thermoplastic modified, low CTE thermosetting pol

Details Low viscosity, thermoplastic modified, low CTE thermosetting pol Low viscosity, thermoplastic modified, low CTE thermosetting pol

1994-06-14

1995-12-12

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523521, 524430, 524494, 525 27, 525 30, 525 49, 525130, 525131, 525179, 525181, C08K 300, C08L 6700

Patent

active

054750407

ABSTRACT:
Filled, thermoplastic-modified thermosetting polyester resin formulations are provided as encapsulants for microelectronics devices. The polyester encapsulant formulations include either a low profile thermoplastic resin additive or a combination of polyethylene and a low shrink thermoplastic additive. In preferred embodiments the polyester encapsulant formulations are of low viscosity and can be utilized in various pressure molding protocols. The encapsulant matrix is characterized by a low coefficient of thermal expansion, very low shrinkage, low modulus, and good thermal conductivity. Microelectronics devices encapsulated with the polyester resin formulation exhibit good resistance to moisture related and stress-induced failure.

REFERENCES:
patent: 4245068 (1981-01-01), Brewbaker et al.
patent: 4298711 (1981-11-01), Moulson et al.
patent: 5075393 (1991-12-01), Thompson

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