Low viscosity hot melt pressure sensitive adhesive compositions

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Details

524474, 524484, 524505, C09U 702, C08L 906

Patent

active

057142548

ABSTRACT:
A low melt viscosity, hot melt pressure sensitive adhesive composition having enhanced tack properties is provided. The composition is based on an S-I-S block copolymer having polystyrene and polyisoprene block segments blended with a petroleum tackifier resin which is a blend of a C.sub.5 -C.sub.9 aromatic modified aliphatic petroleum resin and a hydrogenated, alicyclic monomer containing hydrocarbon resin. The composition optionally also includes a polystyrene-polyisoprene diblock copolymer and a processing oil. The composition may be readily applied as solvent-free melt to various substrates using coating die technology because of its low melt viscosity at coating temperatures.

REFERENCES:
patent: 4104327 (1978-08-01), Inoue et al.
patent: 4411954 (1983-10-01), Butch, III et al.
patent: 4623698 (1986-11-01), Jacob et al.
patent: 4699941 (1987-10-01), Salerno
patent: 5143968 (1992-09-01), Diehl et al.
patent: 5183705 (1993-02-01), Birkholz et al.
Encyclopedia of Chemical Technology, (Fourth Edition), 1995, vol. 13, pp. 727-728.

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