Low toxicity alloy compositions for joining and sealing

Alloys or metallic compositions – Tin base – Copper containing

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144 25, 22826311, C22C 1302

Patent

active

049294237

ABSTRACT:
A lead-free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10 percent by weight of phosphorus, from 0 to 0.20% of a rare earth mixture and the balance tin, together with incidental impurities. The alloy has a similar pasty range (i.e. melting temperature and melting range) to the traditional tin-lead plumbing solders.

REFERENCES:
patent: 736712 (1903-08-01), Fortun et al.
patent: 1483327 (1924-02-01), Bolus
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4806309 (1989-02-01), Tulman

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