Low tolerance probe card and probe ring systems

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Patent

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Details

324758, G01R 3102

Patent

active

059492449

ABSTRACT:
An apparatus to test an integrated circuit has a plurality of contact pads electrically coupled to the integrated circuit to transfer electrical signals to and from the integrated circuit. The apparatus comprises a ring and a plurality of probes. The ring has a ring surface and an opening to a hollow cavity extending through the ring. The ring surface substantially surrounds the opening. The ring has at least one structural reference point affixed thereto, which is offset a known distance and a known direction from the plurality of contact pads. The plurality of probes are positioned on the ring surface extending from a first location exterior to the ring to a second location proximate to the opening. The plurality of probes are affixed to the ring surface, each probe of the plurality of probes having a contact end to contact one contact pad of the plurality of contact pads, each probe of the plurality of probes aligned in such a way so as to orientate each contact end of each probe of the plurality of probes over the opening to contact one contact pad of the plurality of contact pads. Each probe of the plurality of probes aligned in a known relationship from the at least one structural reference point. A process comprises the following steps of creating a plurality of probe guide holes and a plurality of template alignment holes in a film template in a known relationship with one another; affixing and aligning the film template to a fixture; inserting a plurality of probes in the plurality of probe guide holes of the film template; aligning and fitting a probe ring to the fixture; affixing the plurality of probes to the probe ring; and removing the probe ring having the plurality of probes affixed thereto.

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