Fluid handling – Processes
Patent
1990-10-31
1991-08-20
Chambers, A. Michael
Fluid handling
Processes
137561A, E03B 100
Patent
active
050405586
ABSTRACT:
A manifold for dividing a single, two-phase mixed stream of vapor and liquid into a plurality of individual streams of substantially uniform quality. The manifold includes: a flow disperser having an inlet port for receiving the vapor-liquid mixture and at least two outlet ports; at least two hollow runners, each runner having a first end in fluid communication with one of the outlet ports of the flow disperser and a second end; a substantially toroidal manifold shell having at least two fluid receiver ports in fluid communication with each of the second ends of the runners, the manifold shell defining a manifold chamber; and a plurality of distribution ports spaced about the toroidal manifold shell, the distribution ports located on the toroidal manifold shell in a substantially coplanar relationship with the fluid receiver ports, each distribution port in fluid communication with the manifold chamber of the toroidal manifold shell; wherein the vapor-liquid mixture emanating from each the distribution port of the manifold is of substantially uniform quality. A method for uniformly distributing a vapor-liquid mixture is also provided.
REFERENCES:
patent: 2144898 (1938-04-01), Shrode
patent: 3795259 (1974-03-01), Brandin et al.
patent: 3899000 (1975-08-01), Ohlswager et al.
patent: 4085776 (1978-04-01), Derrick, Jr.
patent: 4269211 (1981-05-01), Howard et al.
patent: 4505297 (1985-03-01), Leech, III et al.
patent: 4528919 (1985-07-01), Harbolt et al.
patent: 4574837 (1986-03-01), Aggour et al.
patent: 4662391 (1987-05-01), Tolley
patent: 4800921 (1989-01-01), Greebe
Ballard N. David
Hickey Patrick J.
Chambers A. Michael
McKillop A. J.
Mlotkowski M. J.
Mobil Oil Corporation
Speciale C. J.
LandOfFree
Low thermal stress steam distribution manifold does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low thermal stress steam distribution manifold, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low thermal stress steam distribution manifold will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1001758