Low thermal impedance plastic package

Details Low thermal impedance plastic package Low thermal impedance plastic package

1981-03-23

1983-08-16

James, Andrew J.

357 17, 357 30, 357 74, 350 9620, 350 9621, H01L 2302, H01L 2714, H01L 3300

Patent

active

043994539

ABSTRACT:
A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

REFERENCES:
patent: 3219748 (1965-11-01), Miller
patent: 3340345 (1967-09-01), Campbell
patent: 4186996 (1980-05-01), Bowen et al.
patent: 4295152 (1981-10-01), Khoe et al.
patent: 4302070 (1981-11-01), Nakayama et al.
patent: 4307934 (1981-12-01), Palmer

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