Low thermal impedance light-emitting diode package

Details Low thermal impedance light-emitting diode package Low thermal impedance light-emitting diode package

1979-09-24

1981-05-12

Edlow, Martin H.

357 17, 357 72, H01L 2302

Patent

active

042675596

ABSTRACT:
Disclosed is an assembly for relatively high power light-emitting semiconductor devices that uses simple inexpensive components and construction to provide a heat coupler that reduces the thermal impedance between the active device and the ambient atmosphere by approximately a factor of ten from that of a comparable assembly not incorporating the inventive heat coupler. The active semiconductor device is directly mounted on the heat coupler. The coupler is fabricated from material having good thermal conductivity, such as copper, copper alloys, or aluminum, and is designed to have a large surface area, at least ten times the area of the bonding surface of the active device, in unobstructed contact with the ambient atmosphere, thereby providing efficient heat coupling between the heat source and the ultimate heat sink.

REFERENCES:
patent: 3299331 (1967-01-01), Lacey
patent: 3458779 (1969-07-01), Blank
patent: 3510732 (1970-05-01), Amans
patent: 3614550 (1971-10-01), Marinace
patent: 3805347 (1974-04-01), Collins et al.
patent: 3867666 (1975-02-01), Nyul
patent: 4003074 (1977-01-01), Yonezu
patent: 4032963 (1977-06-01), Thome
patent: 4131911 (1978-12-01), Fujine

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