Low thermal impedance integrated circuit

Details Low thermal impedance integrated circuit Low thermal impedance integrated circuit

1995-06-07

1998-01-20

Dang, Trung

Fishing, trapping, and vermin destroying

437187, 437209, 437184, H01L 21265

Patent

active

057100683

ABSTRACT:
A frontside ground plane (306) integrated circuit with backside contacts (312) plus optional passive components such as microstrip (308) and capacitors. The frontside ground plane provides direct heat dissipation from active junctions such as heterojunction and field effect transistors.

REFERENCES:
patent: 4794093 (1988-12-01), Tong et al.
patent: 4992764 (1991-02-01), Ayasli
patent: 5023993 (1991-06-01), Fengelly
patent: 5084750 (1992-01-01), Alderstein
patent: 5202752 (1993-04-01), Honjo
W.S. Wong, et al., "Flip Chip Manufacturing Technology for GaAs MMIC," Hughes Aircraft Company, Microelectronic Circuits Division, 1993 GaAs Mantech, Conf., pp. 224-227.

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