Low thermal expansivity and high thermal conductivity substrate

Details Low thermal expansivity and high thermal conductivity substrate Low thermal expansivity and high thermal conductivity substrate

1983-10-06

1986-02-11

Lechert, Jr., Stephen J.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75230, 148127, 428212, 428426, 428457, 428546, 428548, 428551, 428570, 428616, 428618, 428620, 428688, 428704, 428901, 501153, 501154, 427 82, 427 93, 427 96, C22C 2912

Patent

active

045696926

ABSTRACT:
A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3306715 (1967-02-01), Schlomer et al.
patent: 3900601 (1975-08-01), Franz et al.
patent: 4061801 (1977-12-01), Hamada et al.
patent: 4125646 (1978-11-01), Dean et al.
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4334926 (1982-06-01), Futamura et al.
patent: 4341841 (1982-07-01), Ohno et al.
patent: 4360702 (1982-11-01), Feng et al.

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