Low thermal expansivity and high thermal conductivity substrate

Details Low thermal expansivity and high thermal conductivity substrate Low thermal expansivity and high thermal conductivity substrate

1986-05-15

1989-06-06

Lechert, Jr., Stephen J.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

148127, 75230, 428212, 428426, 428457, 428546, 428548, 428551, 428570, 428616, 428618, 428620, 428688, 428704, 428901, 427 96, 501153, 501154, C22C 2912

Patent

active

RE0329428

ABSTRACT:
A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3306715 (1967-02-01), Schlomer et al.
patent: 3676292 (1892-07-01), Pryor et al.
patent: 3726987 (1973-04-01), Pryor et al.
patent: 3728177 (1973-04-01), Caule
patent: 3900601 (1975-08-01), Franz et al.
patent: 4061801 (1977-12-01), Hamada et al.
patent: 4125646 (1978-11-01), Dean et al.
patent: 4149910 (1979-04-01), Popplewell
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4330599 (1982-05-01), Winter et al.
patent: 4334926 (1982-06-01), Futamura et al.
patent: 4341841 (1982-07-01), Ohno et al.
patent: 4360702 (1982-11-01), Feng et al.
patent: 4362262 (1982-12-01), Winter et al.
patent: 4410927 (1983-10-01), Butt
patent: 4429022 (1984-01-01), Breedis et al.
patent: 4461924 (1984-07-01), Butt
patent: 4480262 (1984-10-01), Butt
patent: 4491622 (1985-01-01), Butt
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4500028 (1985-02-01), Breedis et al.
patent: 4500605 (1985-02-01), Fister et al.
patent: 4521469 (1985-06-01), Butt et al.
patent: 4524238 (1985-06-01), Butt
patent: 4525422 (1985-06-01), Butt et al.
patent: 4532222 (1985-07-01), Butt
patent: 4542259 (1985-09-01), Butt
patent: 4569692 (1986-02-01), Butt
patent: 4570337 (1986-02-01), Butt
patent: 4577056 (1986-03-01), Butt
patent: 4594770 (1986-06-01), Butt
patent: 4607276 (1986-08-01), Butt
patent: 4625400 (1986-12-01), Fister
patent: 4649083 (1987-03-01), Fister et al.
patent: 4656499 (1987-04-01), Butt
patent: 4659404 (1987-04-01), Butt
"Chemical Engineer's Handbook", John H. Perry, 1963.
"Table 1. Physical Properties of Electrical Resistance Alloys", Metals Handbook, 8th Edition, vol. 1, American Society for Metals, p. 798.

Affiliated with

Also associated with

Rating

Low thermal expansivity and high thermal conductivity substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low thermal expansivity and high thermal conductivity substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low thermal expansivity and high thermal conductivity substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-30402