Low thermal expansion, heat sinking substrate for electronic sur

Details Low thermal expansion, heat sinking substrate for electronic sur Low thermal expansion, heat sinking substrate for electronic sur

1989-06-12

1990-10-16

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428285, 428408, 428457, 428461, 428901, 174250, 361397, B32B 300

Patent

active

049634143

ABSTRACT:
The heat sinking substrate herein disclosed is comprised of a core consisting of a rigid graphitic solid in which hexagonal graphite crystallites are bond together by coal tar pitch, the core being enclosed by two metallic face sheets having a coefficient of thermal expansion suited to the electronic packages it supports. The substrate is designed to be installed into a module with a printed wiring board on either side, the module being installed in parallel with other like modules into a chassis. The heat generated by the electronics is input over the face of the substrate and withdrawn by cooling in the walls of the chassis with which the substrates are in good thermal contact. The grain of the core is aligned for maximum thermal conduction along the path to the chassis walls. The substrate is of low weight, has a CTE matched to the supported electronic packages, high thermal conductance, and uses low cost materials.

REFERENCES:
patent: 4318954 (1982-03-01), Jensen
patent: 4591659 (1986-05-01), Leibowitz
patent: 4609586 (1986-09-01), Jensen et al.
patent: 4689110 (1987-08-01), Leibowitz
patent: 4711804 (1987-12-01), Burgess
patent: 4812792 (1989-03-01), Leibowitz
patent: 4837664 (1989-06-01), Rodriquez, II et al.
patent: 4849858 (1989-07-01), Grapes et al.

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