Low thermal conductance insulated cooling assembly for IC chip m

Details Low thermal conductance insulated cooling assembly for IC chip m Low thermal conductance insulated cooling assembly for IC chip m

1999-10-12

2000-09-26

Doerrler, William

Refrigeration

Structural installation

With electrical component cooling

62272, 62273, F25D 2312

Patent

active

061229261

ABSTRACT:
A cooling assembly for an integrated circuit (IC) chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a low thermal conductivity barrier between its inner and outer walls of insulation.

REFERENCES:
patent: 5028988 (1991-07-01), Porter et al.
patent: 5142443 (1992-08-01), Moore, Jr.
patent: 5268812 (1993-12-01), Conte
patent: 5349823 (1994-09-01), Solomon
patent: 5365749 (1994-11-01), Porter
patent: 5463872 (1995-11-01), Vader et al.
patent: 5504924 (1996-04-01), Ohashi et al.
patent: 5918469 (1999-07-01), Cardella

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