Low temperature-wetting tin-base solder paste

Details Low temperature-wetting tin-base solder paste Low temperature-wetting tin-base solder paste

1992-07-02

1993-07-20

Rosenberg, Peter D.

Alloys or metallic compositions

Tin base

148 24, 228207, 420559, B23K 3534

Patent

active

052290700

ABSTRACT:
A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The second powder is formed of a tin alloy containing indium or bismuth and having a melting temperature less than the first powder. During soldering, the second powder melts during the early stages of the heating cycle to initiate wetting of the faying surfaces and promote dissolution of the first powder, thereby reducing the time and temperature required to form the solder connection.

REFERENCES:
patent: 4797328 (1989-01-01), Boehm
American Society for Metals, "Welding, Brazing and Soldering," Metals Handbook, 9th Edition, vol. 6 (1983) pp. 1069-1101.

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