Low temperature solventless silicone resins

Details Low temperature solventless silicone resins Low temperature solventless silicone resins

1975-08-04

1976-04-06

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 465UA, 2604482H, C08L 8304

Patent

active

039488489

ABSTRACT:
Organosilicon resins having excellent thermal shock resistance in either the filled or unfilled state are obtained by curing mixtures of (A) a copolymer of (in mole percent) 35 to 42 monophenylsiloxane, 0 to 12 diphenylsiloxane, 35 to 50 dimethylsiloxane and 8 to 15 vinylmethylsiloxane with (B) a copolymer of (in mole percent) 8 to 15 diphenylsiloxane, 30 to 55 methylhydrogensiloxane, 28 to 45 dimethylsiloxane and 5 to 12 trimethylsiloxane in amount such that there is a stoichiometric amount of SiH and Si vinyl .+-. 10 percent of either ingredient. The preferred fillers are mixtures of 1/32 to 1/8 inch glass fibers and 2 to 8 microns crystalline silica.

REFERENCES:
patent: 3844992 (1974-10-01), Antonen

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