Low-temperature solder compositions

Details Low-temperature solder compositions Low-temperature solder compositions

1997-09-29

1999-02-16

Ip, Sikyin

Alloys or metallic compositions

Tin base

Lead containing

420589, C22C 1302

Patent

active

058716904

ABSTRACT:
Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

REFERENCES:
patent: 4834794 (1989-05-01), Yagi et al.
patent: 5573602 (1996-11-01), Banerji et al.

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