Low-temperature solder composition

Details Low-temperature solder composition Low-temperature solder composition

1987-06-12

1989-03-28

Rutledge, L. Dewayne

Alloys or metallic compositions

Containing over 50 per cent metal but no base metal

Tin containing

420570, 420571, C22C 3004

Patent

active

048162191

ABSTRACT:
A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.

REFERENCES:
patent: 2220961 (1940-11-01), Kern
patent: 2595925 (1952-05-01), Carlson et al.
patent: 4491562 (1985-01-01), Soga et al.
Metal Progress, May 1932, p. 65.
"Indalloy Specialty Solders", pp. 11, Indium Corporation of America, 1979.

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