Low temperature single step curing polyimide adhesive

Details Low temperature single step curing polyimide adhesive Low temperature single step curing polyimide adhesive

1987-08-19

1988-04-26

Schofer, Joseph L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 68, 357 65, 4273936, 427125, 1563309, 437209, 29832, H01L 2348

Patent

active

047408308

ABSTRACT:
Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.

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patent: 4519941 (1985-05-01), Anderson
"New Aromatic-Ether Bismaleimide Matrix Resins", by James A. Harvey, Richard P. Chartoff & John M. Butler.
"BMIs--Composites for High Temperatures", by John C. Bittence, Advanced Materials & Processes, 1/86--pp. 23-26.
"Characterization of Bismaleimide System", XU 292 by M. Chaudhari, T. Galvin & J. King--Sample Journal, Jul./Aug. 1985--pp. 17-21.

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