Low temperature sealing glass composition

Details Low temperature sealing glass composition Low temperature sealing glass composition

1993-02-09

1994-01-25

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 15, 501 43, 501 75, 501 76, C03C 814, C03C 824, C03C 323, C03C 3072

Patent

active

052815617

ABSTRACT:
A low temperature sealing glass composition suitable for sealing integrated circuit alumina packages at temperatures below 400.degree. C. in a short time of about ten minutes. This sealing glass composition is a mixture of a glass powder and 1 to 50% (by weight) of one or more low expansion ceramic powders. The glass powder comprises a lead borate or lead zinc borate glass and the joint addition of Cu.sub.2 O, Tl.sub.2 O and F in a range of 6.3 to 20% (by weight) wherein the molar ratio of Cu to Tl to F is in the range between 0.8 Cu: 0.8 Tl: 0.8 F to 1.2 Cu: 1.2 Tl: 1.2 F. The glass in powder form is blended with one or more compatible low expansion ceramic powders including cordierite, zircon, willemite, lead titanate or modified tin oxide.

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