Low temperature sealing composition

Details Low temperature sealing composition Low temperature sealing composition

1993-12-08

1994-09-13

Group, Karl

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 17, 501 22, 501 75, 501 41, C03C 810, C03C 824

Patent

active

053468635

ABSTRACT:
A low temperature sealing composition consists essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2. The sealing composition has a low sealing temperature of 400.degree.C. or lower and is useful for readily sealing IC packages and display panels without application of load. In order to adjust the thermal coefficient of expansion, the sealing glass composition may be used by mixing with 20 vol. % to 55 vol. % of refractory filler powder of such as lead titanate based ceramics, willemite based ceramics, cordierite ceramics, zircon based ceramics or tin oxide based ceramics.

REFERENCES:
patent: 4310357 (1982-01-01), Matsuura et al.
patent: 4365021 (1982-12-01), Pirooz
patent: 4696909 (1987-09-01), Weaver
patent: 4704370 (1987-11-01), Seki et al.
patent: 4743302 (1988-05-01), Dumesail et al.
patent: 5281561 (1994-01-01), Dumesnil et al.

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