Low temperature reactive bonding

Details Low temperature reactive bonding Low temperature reactive bonding

1993-11-04

1995-01-17

Rowan, Kurt

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228190, 2282343, 428941, B23K 3102

Patent

active

053819446

ABSTRACT:
The joining technique requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process.

REFERENCES:
patent: 2402834 (1946-06-01), Nachtman
patent: 3396454 (1968-08-01), Murdock et al.
patent: 3415697 (1968-12-01), Bredzs et al.

Affiliated with

Also associated with

Rating

Low temperature reactive bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature reactive bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature reactive bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-742817