Low-temperature-processible copolyesteramides, preparation of mo

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

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524435, 524456, 524602, 524605, 524779, 524785, 524876, 528183, 528184, 528185, 528193, C08G 6944

Patent

active

048391280

ABSTRACT:
Copolyesteramides consisting of specific units can be injection molded at a low temperature into a part having a high heat distortion temperature. A filled composition is obtained by blending the copolyesteramide with an inorganic filler. A magnetic resin composition is obtained by blending the copolyesteramide with an magnetic powder.
The copolyesteramide consists essentially of units <I>, <II>, <III>, <IV>, and <V> of the following formulae: ##STR1## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is independently at least one divalent radical selected from the group consisting of para-phenylene, 2,6-naphthalene, and 4,4'-biphenylene,

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Japanese Patent Application, Kokai No. 58-84821 (only Eng. Abstract available for review).
Japanese Patent Application No. 56-22810 (only Eng. Abstract availabel for review).

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