Stock material or miscellaneous articles – Printed circuit
Reexamination Certificate
2005-11-18
2008-03-25
Woodward, Ana (Department: 1796)
Stock material or miscellaneous articles
Printed circuit
C174S254000, C174S255000, C174S257000, C428S098000, C428S209000, C428S221000, C428S473500
Reexamination Certificate
active
07348080
ABSTRACT:
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2wherein R is hydrocarbon from C4to C16and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C.The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
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E.I. du Pont de Nemours and Company
Woodward Ana
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