Low temperature polyimide adhesive compositions and methods...

Details Low temperature polyimide adhesive compositions and methods... Low temperature polyimide adhesive compositions and methods...

2008-03-25

2008-03-25

Woodward, Ana (Department: 1711)

Stock material or miscellaneous articles

Composite

Of metal

C428S473500

Reexamination Certificate

active

11282415

ABSTRACT:
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2wherein R is hydrocarbon from C4to C16and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C.The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.

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