Low temperature polyimide adhesive compositions and methods...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Reexamination Certificate

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C528S125000, C528S128000, C528S172000, C528S173000, C528S179000, C528S183000, C528S185000, C528S220000, C528S229000, C528S176000, C528S350000, C528S353000, C528S188000, C524S600000, C524S602000, C525S420000, C525S422000, C525S432000

Reexamination Certificate

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07026436

ABSTRACT:
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2wherein R is hydrocarbon from C4to C16and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C.The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.

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