Low temperature phase change thermal interface material dam

Details Low temperature phase change thermal interface material dam Low temperature phase change thermal interface material dam

2007-12-25

2007-12-25

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S686000, C257S704000, C438S122000, C438S125000

Reexamination Certificate

active

11305527

ABSTRACT:
A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

REFERENCES:
patent: 5909056 (1999-06-01), Mertol
patent: 6150195 (2000-11-01), Chiu et al.
patent: 6362513 (2002-03-01), Wester
patent: 6391683 (2002-05-01), Chiu et al.
patent: 6891259 (2005-05-01), Im et al.
patent: 2006/0042054 (2006-03-01), Kippes et al.
Pending U.S. Appl. No. 11/095,693; Title: Structure and Method to Control Underfill ; Inventor: Sandeep B. Sane; filed Mar. 31, 2005.
Pending U.S. Appl. No. 11/072,112; Title: Method for Reducing Assembly-Induced Stress in a Semiconductor Die; Inventor: Deshpande et al.; filed Mar. 3, 2005.

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