Low-temperature patterned wafer bonding with photosensitive...

Details Low-temperature patterned wafer bonding with photosensitive... Low-temperature patterned wafer bonding with photosensitive...

2005-09-13

2005-09-13

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S292000, C438S456000, C438S753000

Reexamination Certificate

active

06942750

ABSTRACT:
A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having a second surface. Photosensitive benzocyclobutene (BCB) polymer is then applied to the first surface of the first wafer in a predetermined pattern to define a bonding layer. The second wafer is then bonded to the first wafer only along the bonding layer.

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