Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-08-09
1998-09-29
McCamish, Marion E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156326, 156327, 156325, 4283171, 4283173, 4283175, 4283177, 428343, 428344, 428354, C09J 508, C09J 902
Patent
active
058141804
ABSTRACT:
A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.
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Patent Abstracts of Japan vol. 017, No. 009 (E-1303) 8 Jan. 1993 & JP, A, 04 242 010 (Sony Chem Corp) 28, Aug. 1992.
Cole Elizabeth M.
Genco, Jr. Victor M.
McCamish Marion E.
W. L. Gore & Associates, Inc.
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