Metal fusion bonding – Process – Plural joints
Patent
1992-10-08
1993-12-14
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228195, 228254, H05K 334
Patent
active
052694534
ABSTRACT:
An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.
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Cholewczynski Kenneth
Melton Cynthia M.
Moore Kevin D.
Raleigh Carl
Fekete Douglas D.
Heinrich Samuel M.
Motorola Inc.
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