Low temperature metal cleaning composition

Details Low temperature metal cleaning composition Low temperature metal cleaning composition

1977-01-24

1977-09-13

Albrecht, Dennis L.

Compositions

Electrically conductive or emissive compositions

Metal compound containing

252 89R, 252135, 252139, 252156, 252158, 252DIG1, C11D 1825, C11D 343, C23G 114, C23G 502

Patent

active

040481212

ABSTRACT:
Metal cleaning formulation for the preparation of low temperature-low foam aqueous metal cleaning and polishing baths. The formulation includes an alkaline builder consisting of sodium metasilicate together with sodium hydroxide, sodium carbonate, or mixtures thereof. The system includes sodium gluconate, the tetrasodium salt of ethylenediaminetetraacetic acid, kerosine, and a biodegradable wetting agent system. The wetting agent system utilizes a mixture of linear primary alcohol polyethers and a linear alcohol alkoxylate, with the linear primary alcohol polyethers having cloud points of about 40.degree. C. and 26.degree. C. respectively, and with the linear alcohol alkoxylate having a cloud point of about 20.degree. C. The formulation is free of either poly or orthophosphates.

REFERENCES:
patent: 2104385 (1938-01-01), Hendrey
patent: 2992995 (1961-07-01), Arden
patent: 3222201 (1965-12-01), Boyle
patent: 3255118 (1966-06-01), Carroll
patent: 3705856 (1972-12-01), Sedliar
patent: 3707506 (1972-12-01), Lozo
patent: 3870647 (1975-03-01), Travers
patent: 3927970 (1975-12-01), Ciko
patent: 3948819 (1976-04-01), Wilde
patent: 3985670 (1976-10-01), Berg
patent: 3994818 (1976-11-01), Loo

Affiliated with

Also associated with

Rating

Low temperature metal cleaning composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature metal cleaning composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature metal cleaning composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-272688