Low temperature material bonding technique

Details Low temperature material bonding technique Low temperature material bonding technique

1998-06-17

2000-10-10

Gulakowski, Randy

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 33, 65 43, 156146, 1563086, 156322, 4272082, 427240, 427307, H01B 1766

Patent

active

061298549

ABSTRACT:
A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

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