Low temperature, low pressure, ductile, bonded cermet for enhanc

Details Low temperature, low pressure, ductile, bonded cermet for enhanc Low temperature, low pressure, ductile, bonded cermet for enhanc

1995-08-22

1997-06-24

Mai, Ngoclan

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75236, 75244, 75245, 75248, 419 8, 419 12, 419 13, 419 14, 419 48, 419 57, 148206, 51309, C22C 2900, B22F 700

Patent

active

056419210

ABSTRACT:
This invention is directed toward a material which is used to coat or create a surface for machine cutting tools, all types of drill bit teeth, saw teeth, bearing surfaces valve seats, nozzles and the like, thereby producing surfaces which are highly abrasion and erosion resistant. Furthermore, this invention includes some of the possible methods for producing such a material given that the methods and apparatus required provide a significant cost reduction over those required for producing prior art surface materials with similar abrasion and erosion resistant properties. More specifically, the material set forth can be formed at relatively low temperatures and relatively low pressures by sintering mixtures for a relatively short period of time.

REFERENCES:
patent: Re32036 (1985-11-01), Dennis
patent: 3136615 (1964-06-01), Bovenkerk et al.
patent: 3233988 (1966-02-01), Wentorf, Jr. et al.
patent: 3609818 (1971-10-01), Wentorf, Jr.
patent: 3745623 (1973-07-01), Wentorf, Jr. et al.
patent: 4255165 (1981-03-01), Dennis et al.
patent: 4604106 (1986-08-01), Hall et al.
patent: 4647546 (1987-03-01), Hall, Jr. et al.
patent: 4662896 (1987-05-01), Dennis
patent: 4784023 (1988-11-01), Dennis
patent: 5011514 (1991-04-01), Cho et al.
patent: 5011515 (1991-04-01), Frushour
patent: 5096465 (1992-03-01), Chen et al.
patent: 5116568 (1992-05-01), Sung et al.
patent: 5211726 (1993-05-01), Slutz et al.

Affiliated with

Also associated with

Rating

Low temperature, low pressure, ductile, bonded cermet for enhanc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature, low pressure, ductile, bonded cermet for enhanc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature, low pressure, ductile, bonded cermet for enhanc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-150329