Low temperature lead-free solder compositions

Details Low temperature lead-free solder compositions Low temperature lead-free solder compositions

1996-11-26

1998-05-26

Ip, Sikyin

Metal treatment

Stock

148442, 420577, 420562, 420589, C22C 700, C22C 1200, C22C 1302, C22C 3004

Patent

active

057558965

ABSTRACT:
Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

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