Low-temperature impact resistant thermosetting epoxide resin...

Details Low-temperature impact resistant thermosetting epoxide resin... Low-temperature impact resistant thermosetting epoxide resin...

2006-07-05

2011-11-22

Feely, Michael J (Department: 1761)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C525S523000, C525S524000, C525S525000, C525S526000, C525S528000, C428S414000

Reexamination Certificate

active

08062468

ABSTRACT:
The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

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