Low temperature glass composition, paste and method of use

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 113, 252514, 501 19, 501 32, 501 46, C03C 321, C03C 818

Patent

active

049330306

ABSTRACT:
A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.

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patent: 4761224 (1988-08-01), Husson, Jr. et al.
JMI AuSub Die Attach Paste (Johnson Matthey Electronic Materials Div.).
Development of Adhesive Die Attach Technology in Cerdip Packages; Material Issues*, F. K. Moghadam, Jan. '84.
New Die Attach Material for Hermetic Packaging, R. L. Dietz and L. Winder, 1983.

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