Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Reexamination Certificate
2005-10-11
2005-10-11
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
C228S206000, C228S208000, C134S002000
Reexamination Certificate
active
06953146
ABSTRACT:
A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory alloy members for soldering and permits joining of such members to other members, comprising, for example, stainless steel, used in structures like medical devices. The flux is a non-aqueous molten salt formulated on eutectic mixtures of KOH (potassium hydroxide), NaOH (sodium hydroxide) and LiOH (lithium hydroxide), with melting temperatures in a range from about 170° C. to about 226° C.
REFERENCES:
patent: 2569097 (1951-09-01), Grange et al.
patent: 2818075 (1957-12-01), Dunlevy et al.
patent: 2833679 (1958-05-01), Steinberg
patent: 2991195 (1961-07-01), Quinn
patent: 3081534 (1963-03-01), Bredzs
patent: 3156978 (1964-11-01), Hanink et al.
patent: 3625900 (1971-12-01), Shoemaker et al.
patent: 3690921 (1972-09-01), Elmore
patent: 4504324 (1985-03-01), Furuno
patent: 4994157 (1991-02-01), Itoh et al.
patent: 5242759 (1993-09-01), Hall
patent: 5354623 (1994-10-01), Hall
patent: 5505786 (1996-04-01), Cole et al.
patent: 5695111 (1997-12-01), Nanis et al.
patent: 5939774 (1999-08-01), Yamada
patent: 6090105 (2000-07-01), Zepeda et al.
patent: 6183828 (2001-02-01), Starcke et al.
patent: 6371970 (2002-04-01), Khosravi et al.
patent: 6379818 (2002-04-01), Mooij et al.
patent: 6475289 (2002-11-01), Schilbe et al.
patent: 2002/0100493 (2002-08-01), Kool et al.
patent: 10-121278 (1998-05-01), None
Pelton, et al., pp. 395-400, Proceedings of the Second International Conference on Shape Memory and Superelastic Technologies, Mar. 1997; published by SMST, Santa Clara, CA, ISBN 0-9660508-1-9.
P. Hall, “Methods of Promoting Solder Wetting on Nitinol,” p. 126, Proceedings of the Second International Conference on Shape Memory and Superelastic Technologies, Mar. 1997; published by SMST, Santa Clara, CA, ISBN 0-9660508-1-9.
Chapter 3 of “Scanning Electron Microscopy and X-Ray Microanalysis,” Goldstein, Newbury, Exhlin, Joy, Fiori and Lifshin, Plenum Press, 1981, ISBN 0-306-40768-X.
Edmondson Lynne R.
Haynes Mark A.
Haynes Beffel & Wolfeld LLP
LandOfFree
Low-temperature flux for soldering nickel-titanium alloys... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low-temperature flux for soldering nickel-titanium alloys..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-temperature flux for soldering nickel-titanium alloys... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3449177