Low-temperature flux for soldering nickel-titanium alloys...

Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...

Reexamination Certificate

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C228S206000, C228S208000, C134S002000

Reexamination Certificate

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06953146

ABSTRACT:
A low-temperature flux is described which dissolves the refractory oxide layer from a shape memory alloy containing both nickel and titanium, such as Nitinol, and from other metals like stainless steel. The flux is particularly useful for preparing shape memory alloy members for soldering and permits joining of such members to other members, comprising, for example, stainless steel, used in structures like medical devices. The flux is a non-aqueous molten salt formulated on eutectic mixtures of KOH (potassium hydroxide), NaOH (sodium hydroxide) and LiOH (lithium hydroxide), with melting temperatures in a range from about 170° C. to about 226° C.

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