Low temperature flexible die attach adhesive and articles using

Details Low temperature flexible die attach adhesive and articles using Low temperature flexible die attach adhesive and articles using

1995-10-16

1997-03-18

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524377, C08K 308

Patent

active

056124031

ABSTRACT:
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

REFERENCES:
patent: 1743167 (1930-01-01), Styer
patent: 2895270 (1930-01-01), Blaess
patent: 3586926 (1971-06-01), Nakamura et al.
patent: 3595900 (1971-07-01), Loudas et al.
patent: 3658623 (1972-04-01), Grigat et al.
patent: 4280885 (1981-07-01), Savery
patent: 4369302 (1983-01-01), Ikeguchi et al.
patent: 4375498 (1983-03-01), Le Minez et al.
patent: 4401776 (1983-08-01), Munk
patent: 4552690 (1985-11-01), Ikeguchi et al.
patent: 4604452 (1986-08-01), Shimp
patent: 4608434 (1986-08-01), Shimp
patent: 4699888 (1987-10-01), Dumesnil et al.
patent: 4709008 (1987-11-01), Shimp
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4740343 (1988-04-01), Gaku et al.
patent: 4740584 (1988-04-01), Shimp
patent: 4740830 (1988-04-01), Ketley
patent: 4754001 (1988-06-01), Blahak et al.
patent: 4785075 (1988-11-01), Shimp
patent: 4831086 (1989-05-01), Das et al.
patent: 4839442 (1989-06-01), Craig, Jr.
patent: 4847233 (1989-07-01), Shimp
patent: 4861823 (1989-08-01), Qureshi
patent: 4902752 (1990-02-01), Shimp
patent: 4918157 (1990-04-01), Gardner
patent: 4931545 (1990-06-01), Shimp et al.
patent: 4940848 (1990-07-01), Shimp
patent: 4983683 (1991-01-01), Shimp
patent: 4999699 (1991-03-01), Christie et al.
patent: 5002818 (1991-03-01), Licari et al.
patent: 5036646 (1991-08-01), Makihara et al.
patent: 5037692 (1991-08-01), Medney et al.
patent: 5056296 (1991-10-01), Ross et al.
patent: 5068309 (1991-11-01), Shimp
patent: 5114003 (1992-05-01), Jackisch et al.
patent: 5143785 (1992-09-01), Pujol et al.
patent: 5149863 (1992-09-01), Shimp et al.
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5162574 (1992-11-01), Craig, Jr.
patent: 5186880 (1993-02-01), Gaku et al.
patent: 5195299 (1993-03-01), Nguyen
patent: 5215860 (1993-06-01), McCormick et al.
patent: 5250600 (1993-10-01), Nguyen et al.
patent: 5261157 (1993-11-01), Chang
patent: 5325654 (1994-07-01), Juntunen et al.
patent: 5330684 (1994-07-01), Emori et al.
patent: 5399907 (1995-03-01), Nguyen et al.
D.A. Shimp, et al., "AroCy.RTM. Cyanate Ester Resin, Chemistry, Properties and Applications, " Rh one-Poulenc, Inc.; Jan. 1990, pp. 1-36.
E. Grigat and R. Putter, "New Methods of Preparative Organic Chemistry VI-Synthesis and Reactions of Cyanic Esters, " Agnew. Chem. Internat. Edit., vol. 6, Nov. 3, 1967, pp. 206-216.
Hi-Tek Polymers, "AroCy.RTM. L-10 Cyanate Ester Monomer, : " Oct. 1989.
Hi-Tek Polymers, "AroCy.RTM. Cyanate Ester Resins. "
Hi-Tek Polymers, "AroCy.RTM. F-40S Cyanate Ester Resin Solution, " Apr. 1989.
Hi-Tek Polymers, "AroCy.RTM. B-10 Cyanate Ester Monomer, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. B-40S Cyanate Ester Resin Solution, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. B-50 Cyanate Ester Hard Resin, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. M-10 Cyanate Ester Monomer, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. M-30 Cyanate Ester Semisolid Resin, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. M-40S Cyanate Ester Resin Solution, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. M-50 Cyanate Ester Hard Resin, " Oct. 1988.
Hi-Tek Polymers, "AroCy.RTM. T-30 Cyanate Ester Semisolid Resin, " Oct. 1988.
Allied Signal Inc., "Primaset--PT Resins, Safety and Handling Bulletin, " Mar. 20, 1992.
Allied Signal Inc., "Primaset--PT Resins. "
Allied Signa Inc., "Primaset--PT Resins, Literature List. "
Tactix Performance Polymers, "XU-71787.02, XU-71787.07, Developmental Polycyanate Resins for Advanced Composites and Adhesives. "
Sajal Das, "Pheno-Triazine (PT) Resin, A New Family of High Performance Thermosets" Cyanate Ester Symposium, Apr. 9-10, 1992.
D.A. Shimp and S.J. Ising, "Moisture Effects and their Control in the Curing of Polycyanate Resins, " Cyanate Ester Symposium, Apr. 9-10, 1992.
S.L. Simon and J.K. Gillham, "Cure of a Dicyanate Ester/Polycyanurates System, " Cyanate Ester Symposium, Apr. 9-10, 1992.
Fraunhofer Institut fur Angewandte Materialforschung, "Polycyanurates and Their Modifications, State of the Art and New Aspects, " Gordon Research Conference on Thermoset, Jun. 1993.
Hi-Tek Polymers, "AroCy.RTM. Resins, " Dec. 1988.
David Shimp and Mark Southcott, "Controlling Moisture Effects During the Curing to High TG Cyanate Ester/Aramid Composites, " 38th International Symposium and Exhibition, May 10-13, 1993.
Rh one-Poulenc, "Specialty Resin--Reactive Rubber Toughners for AroCy.RTM. Cyanate Ester Resins, " Jan. 1991.
Rh one-Poulenc, "Specialty Resins--Pyrolysis of AroCy.RTM. Cyanate Esters. "
Rh one-Poulenc, "Specialty Resins--Quantative Determination of Residual Cyanate in Cured Homopolymers Via FTIR Analysis, " Jan. 2, 1992.
Rh one-Poulenc, "Specialty Resins--Compatibility of Cyanate Esters with Aramid Reinforcements and Polyamide/Imide Substrates. "
RH one-Poulenc, "Specialty Resins--AroCy.RTM. L-10 Cyanate Ester Monomer, " Sep. 1990.
RH one-Poulenc, "Specialty Resins--AroCy.RTM. F-10 Cyanate Ester Monomer, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. M-20 Low Melt Viscosity Prepolymer, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--ArcoCy.RTM. B-10 Cyanate Ester Monomer, " Oct. 1990.
Rh one-Poulenc, "Specialty Resins--Toxicity of AroCy.RTM. Cyanate Esters. "
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. M-10 Cyanate Ester Monomer, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. Cyanate Ester Resins. "
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. Cyanate Ester" List.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. F40-S Cyanate Ester Resin Solution, " Jul. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. B-30 Cyanate Ester Semisolid Resin. "
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. B-40S Cyanate Ester Resin Solution, " Aug. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. B-50 Cyanate Ester Hard Resin, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. B-40S Cyanate Ester Resin Solution, " Aug. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. M-30 Cyanate Ester Semisolid Resin, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. M-50 Cyanate Ester Hard Resin, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. Cyanate Ester Safety and Handling Bulletin, " Sep. 1990.
Rh one-Poulenc, "Specialty Resins--Formulating ArcOy.RTM. Cyanate Esters for Resin Transfer Molding Applications, " Apr. 1991.
Rh one-Poulenc, "Specialty Resins--AroCy.RTM. Cyanate Ester Adhesives for Polyimide Flexible Circuitry, " Jan. 1991.
Rh one-Poulenc, "Galvanic Corrosion of Carbon Fiber Composites, " Jan. 1991.
Hi-Tek Polymers, "REX-378 Developmental Cyanate Ester Prepolymer. "
Uri Sela and Hans Steinegger, "Dispensing Technology-The Key to High-Quality, High-Speed Die Bonding, " Microelectronics Manufacturing Technology, Feb. 1991, pp. 47-52.
Jack R. Christenson and David A. Shimp, "Improvements in Performance and Processing Using Cyanate Ester Blends and Alloys, " Ultralloy '90, pp. 191-208.
Tony del Rosario, "JM 7000 Low Temperature Die Attach Material Qualification Report, " Olin Interconnect Technologies, Dec. 10, 1992.
Malcolm L. White, et al., "Attaining Low Moisture Levels in Hermetic Packages, " IEEE/Proc. IRPS, 1982, pp. 253-259.
David P. Galloway and My N. Nguyen, "A New, Reliable Snap Cure Die Attach Adhesive, " May. Res. Soc. Symp. Proc., vol. 264, 1992, pp. 271-280.
Sue Oliver, et al., "Silver/Polymer Die Attach for Ceramic Package Assembly, " 1992 IEPS meeting, Sep. 27-30, 1992.
My N. Nguyen and Michael B. Grosse, "Low Polymer Moisture Adhesive for Hermetic Packages, " IEEE Trans. on Components, Hybrids and Manufacturing Technology, vol. 15, No. 6, Dec. 1992, pp. 964-971.
Richard H. Estes, "A Practical Approach to Die Attach Adhesive Selection, " Hybrid Circuit Technology, Jun. 1991.
Tom Ramsey and Gail Heinen, "Controlling Moisture in Ceramic Packages, " Semiconductor International, Aug. 1988.
Mitsubishi Gas Chemical Company, Inc., "High Heat Resistant BT Resin--Bismaleimide-Triazine Resin, " Fourth Edition, Sep. 1, 1984.
Sue Oliver, "Qualification Sta

Affiliated with

Also associated with

Rating

Low temperature flexible die attach adhesive and articles using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature flexible die attach adhesive and articles using , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature flexible die attach adhesive and articles using will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1706942